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MRF6S20010NR1 MRF6S20010GNR1
27
RF Device Data
Freescale Semiconductor
REVISION HISTORY (cont.)
Revision
Date
Description
4
Jan. 2014
?
Table 2. Thermal Characteristics: CW
thermal value changed from 2.5 to 2.3?C/W to reflect recent thermal
test results; two--tone test W PEP thermal value changed from 5.9 to 2.9?C/W to reflect recent thermal test
results. Thermal value changes are based on an improvement in the RF feedback resistor design, p. 2
?
Table 3, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production.
ESD ratings provided in the data sheet are intended to be used as a guideline when handling ESD
sensitive devices, p. 2
?
Fig. 12, MTTF versus Junction Temperature removed, p. 7. Refer to the device’s MTTF Calculator
available at freescale.com/RFpower. Go to Design Resources > Software and Tools.
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